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 HiPerFETTM Power MOSFETs
Q-Class
N-Channel Enhancement Mode Avalanche Rated High dv/dt, Low Qg
Preliminary data sheet
IXFH 66N20Q IXFT 66N20Q
VDSS ID25
RDS(on)
= 200 V = 66 A = 40 m
trr 200 ns
Symbol VDSS VDGR VGS VGSM ID25 IDM IAR EAR EAS dv/dt PD TJ TJM Tstg TL Md Weight
Test Conditions TJ = 25C to 150C TJ = 25C to 150C; RGS = 1 M Continuous Transient TC = 25C TC = 25C, pulse width limited by TJM TC = 25C TC = 25C TC = 25C IS IDM, di/dt 100 A/s, VDD VDSS, TJ 150C, RG = 2 TC = 25C
Maximum Ratings 200 200 30 40 66 264 66 40 1.5 20 400 -55 ... +150 150 -55 ... +150 V V V V A A A mJ J V/ns W C C C C
TO-268 (D3) (IXFT) Case Style
G S
(TAB)
TO-247 AD
(TAB)
G = Gate S = Source
D = Drain TAB = Drain
1.6 mm (0.062 in.) from case for 10 s Mounting torque TO-247 TO-268
300
Features IXYS advanced low Qg process International standard packages Low gate charge and capacitance - easier to drive - faster switching Low RDS (on) Unclamped Inductive Switching (UIS) rated Molding epoxies meet UL 94 V-0 flammability classification
1.13/10 Nm/lb.in. 6 4 g g
Symbol Test Conditions (TJ = 25C, unless otherwise specified) VDSS VGS(th) IGSS IDSS RDS(on) VGS = 0 V, ID = 250 A VDS = VGS, ID = 4 mA VGS = 30 VDC, VDS = 0 VDS = VDSS VGS = 0 V TJ = 25C TJ = 125C
Characteristic Values Min. Typ. Max. 200 2.0 4.0 100 25 1 40 V V nA A mA m
Advantages Easy to mount Space savings High power density
VGS = 10 V, ID = 0.5 ID25 Pulse test, t 300 s, duty cycle d 2 %
(c) 2003 IXYS All rights reserved
DS99039(04/03)
IXFH 66N20Q IXFT 66N20Q
Symbol Test Conditions Characteristic Values (TJ = 25C, unless otherwise specified) Min. Typ. Max. 30 45 3700 VGS = 0 V, VDS = 25 V, f = 1 MHz 860 260 20 VGS = 10 V, VDS = 0.5 VDSS, ID = 0.5 ID25 RG = 2.0 (External) 18 50 14 105 VGS = 10 V, VDS = 0.5 VDSS, ID = 0.5 ID25 20 44 0.31 (TO-247) 0.25 S pF pF pF ns ns ns ns nC nC nC K/W K/W
Terminals: 1 - Gate 3 - Source 2 - Drain Tab - Drain
1 2 3
TO-247 AD Outline
gfs Ciss Coss C rss td(on) tr td(off) tf Qg(on) Qgs Qgd RthJC RthCK
VDS = 10 V; ID = 0.5 ID25, pulse test
Dim.
Source-Drain Diode Symbol IS ISM VSD t rr QRM IRM Test Conditions VGS = 0 V Repetitive;
Characteristic Values (TJ = 25C, unless otherwise specified) min. typ. max. 66 264 1.5 200 A A V ns C A
Millimeter Min. Max. A 4.7 5.3 2.2 2.54 A1 A2 2.2 2.6 b 1.0 1.4 b1 1.65 2.13 b2 2.87 3.12 C .4 .8 D 20.80 21.46 E 15.75 16.26 e 5.20 5.72 L 19.81 20.32 L1 4.50 P 3.55 3.65 Q 5.89 6.40 R 4.32 5.49 S 6.15 BSC
Inches Min. Max. .185 .209 .087 .102 .059 .098 .040 .055 .065 .084 .113 .123 .016 .031 .819 .845 .610 .640 0.205 0.225 .780 .800 .177 .140 .144 0.232 0.252 .170 .216 242 BSC
TO-268 Outline
IF = IS, VGS = 0 V, Pulse test, t 300 s, duty cycle d 2 % IF = 25A, -di/dt = 100 A/s, VR = 100 V 0.6 7
Min. Recommended Footprint Dimensions in mm and inches
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETs and IGBTs are covered by one or more of the following U.S. patents: 4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715 6,306,728B1 6,259,123B1 6,306,728B1 4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025 6,404,065B1 6,162,665 6,534,343
IXFH 66N20Q IXFT 66N20Q
Fig. 1. Output Characteristics @ 25 Deg. C
70 60 50 40 30 20 1 0 0 0 0.5 1 VG S = 10V 7V 6V 1 80 1 50 VG S = 10V 8V 7V
Fig. 2. Extended Output Characteristics @ 25 deg. C
I D - Amperes
I D - Amperes
1 20 90 60 30 0
6V
5V
5V
V DS - Volts
1 .5
2
2.5
3
3.5
0
3
6
9
1 2
1 5
V D S - Volts
Fig. 3. Output Characteristics @ 125 Deg. C
70 60 VG S = 10V 7V
Fig. 4. RDS(on) Normalized to ID25 Value vs. Junction Temperature
2.8 2.5 VG S = 10V
RD S (on) - Normalized
6V
I D - Amperes
50 40 30 20 1 0 0 0 1 2 3 4 5 6 7 5V
2.2 1 .9 1 .6 1 .3 1 0.7 0.4 -50 -25 0 25 50 75 1 00 1 25 1 50 I D = 66A I D = 33A
V DS - Volts
TJ - Degrees Centigrade
Fig. 5. RDS(on) Normalized to I D25 Value vs. ID
3.5 3 VG S = 10V 70 60
Fig. 6. Drain Current vs. Case Temperature
RD S (on) - Normalized
I D - Amperes
2.5 2 1 .5 1 0.5 0 33 66 99 1 32 1 65 T J = 25 C T J = 125 C
50 40 30 20 1 0 0 -50 -25 0 25 50 75 1 00 1 25 1 50
I D - Amperes
TC - Degrees Centigrade
(c) 2003 IXYS All rights reserved
IXFH 66N20Q IXFT 66N20Q
Fig. 7. Input Admittance
1 65 90 80 1 32 70 T J = -40 C 25 C 125 C
Fig. 8. Transconductance
g f s - Siemens
I D - Amperes
60 50 40 30 20 1 0 0
99
66
T J = -40 C 25 C 125 C
33
0 3 3.5 4 4.5 5 5.5 6 6.5 7
0
33
66
99
132
1 65
V G S - Volts
I D - Amperes
Fig. 9. Source Current vs. Source-To-Drain Voltage
1 98 1 65 1 0
Fig. 10. Gate Charge
VD S = 100V I D = 33A I G = 10mA
8
I S - Amperes
VG S - Volts
T J = 25 C
1 32 99 66 33 0 0.4 0.6 0.8 1 1 .2 1 .4 T J = 125 C
6
4
2
0 0 20 40 60 80 1 00 1 20
V SD - Volts
QG - nanoCoulombs
Fig. 11. Capacitance
1 0000 f = 1M Hz 1
Fig. 12. Maximum Transient Thermal Resistance
Capacitance - p F
R (th) J C - (C/W)
30 35 40
C iss
1 000 C oss
0.1
C rss 1 00 0 5 1 0 1 5 0.01 20 25
V DS - Volts
1
Pulse Width - milliseconds
1 0
1 00
1 000
IXYS reserves the right to change limits, test conditions, and dimensions.
IXYS MOSFETs and IGBTs are covered by one or more of the following U.S. patents: 4,835,592 4,881,106 5,017,508 5,049,961 5,187,117 5,486,715 6,306,728B1 6,259,123B1 6,306,728B1 4,850,072 4,931,844 5,034,796 5,063,307 5,237,481 5,381,025 6,404,065B1 6,162,665 6,534,343


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